? semiconductor components industries, llc, 2013 may, 2013 ? rev. 2 1 publication order number: mc74hc10a/d mc74hc10a triple 3-input nand gate high ? performance silicon ? gate cmos the mc74hc10a is identical in pinout to the ls10. the device inputs are compatible with standard cmos outputs; with pullup resistors, they are compatible with lsttl outputs. features ? output drive capability: 10 lsttl loads ? outputs directly interface to cmos, nmos and ttl ? operating voltage range: 2 to 6 v ? low input current: 1 a ? high noise immunity characteristic of cmos devices ? in compliance with the requirements defined jedec standard no. 7 a ? chip complexity: 36 fets or 9 equivalent gates ? these are pb ? free devices logic diagram pin 14 = v cc pin 7 = gnd y = abc a1 b1 c1 a2 b2 c2 a3 b3 c3 y1 1 2 13 y2 y3 3 4 5 9 10 11 12 6 8 pin assignment 11 12 13 14 8 9 10 5 4 3 2 1 7 6 b3 c3 y1 c1 v cc y3 a3 b2 a2 b1 a1 gnd y2 c2 marking diagrams a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g or = pb ? free package l l h h l h l h function table inputs output ab h h h l y see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information http://onsemi.com tssop ? 14 dt suffix case 948g 14 1 soic ? 14 d suffix case 751a 14 1 hc10ag awlyww 1 14 hc 10a alyw 1 14 (note: microdot may be in either location)
mc74hc10a http://onsemi.com 2 maximum ratings* symbol parameter value unit v cc dc supply voltage (referenced to gnd) ? 0.5 to + 7.0 v v in dc input voltage (referenced to gnd) ? 0.5 to v cc + 0.5 v v out dc output voltage (referenced to gnd) ? 0.5 to v cc + 0.5 v i in dc input current, per pin 20 ma i out dc output current, per pin 25 ma i cc dc supply current, v cc and gnd pins 50 ma p d power dissipation in still air soic package? tssop package? 500 450 mw t stg storage temperature ? 65 to + 150 c t l lead temperature, 1 mm from case for 10 seconds (soic or tssop package) 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recomme nded operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. ?derating ? soic package: ?7 mw/ c from 65 to 125 c tssop package: ? 6.1 mw/ c from 65 to 125 c recommended operating conditions symbol parameter min max unit v cc dc supply voltage (referenced to gnd) 2.0 6.0 v v in , v out dc input voltage, output voltage (referenced to gnd) 0 v cc v t a operating temperature, all package types ? 55 + 125 c t r , t f input rise and fall time v cc = 2.0 v (figure 1) v cc = 3.0 v v cc = 4.5 v v cc = 6.0 v 0 0 0 0 1000 600 500 400 ns this device contains protection circuitry to guard against damage due to high static voltages or electric fields. however, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high ? impedance cir- cuit. for proper operation, v in and v out should be constrained to the range gnd (v in or v out ) v cc . unused inputs must always be tied to an appropriate logic voltage level (e.g., either gnd or v cc ). unused outputs must be left open.
mc74hc10a http://onsemi.com 3 ?????????????????????????????????? ?????????????????????????????????? (voltages referenced to gnd) symbol parameter test conditions v cc v guaranteed limit unit ? 55 to 25 c 85 c 125 c v ih minimum high ? level input voltage v out = 0.1 v or v cc ? 0.1 v |i out | 20 a 2.0 3.0 4.5 6.0 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 v v il maximum low ? level input voltage v out = 0.1 v or v cc ? 0.1 v |i out | 20 a 2.0 3.0 4.5 6.0 0.5 0.9 1.35 1.8 0.5 0.9 1.35 1.8 0.5 0.9 1.35 1.8 v v oh minimum high ? level output voltage v in = v ih or v il |i out | 20 a 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 v v in = v ih or v il |i out | 2.4 ma |i out | 4.0 ma |i out | 5.2 ma 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.20 3.70 5.20 v ol maximum low ? level output voltage v in = v ih |i out | 20 a 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il |i out | 2.4 ma |i out | 4.0 ma |i out | 5.2 ma 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.40 0.40 0.40 i in maximum input leakage current v in = v cc or gnd 6.0 0.1 1.0 1.0 a i cc maximum quiescent supply current (per package) v in = v cc or gnd i out = 0 a 6.0 1 10 40 a ?????????????????????????????????? ?????????????????????????????????? ac electrical characteristics (c l = 50 pf, input t r = t f = 6 ns) symbol parameter v cc v guaranteed limit unit ? 55 to 25 c 85 c 125 c t plh , t phl maximum propagation delay, input a, b, or c to output y (figures 1 and 2) 2.0 3.0 4.5 6.0 95 45 19 16 120 60 24 20 145 75 29 25 ns t tlh , t thl maximum output transition time, any output (figures 1 and 2) 2.0 3.0 4.5 6.0 75 30 15 13 95 40 19 16 110 55 22 19 ns c in maximum input capacitance ? 10 10 10 pf c pd power dissipation capacitance (per gate)* typical @ 25 c, v cc = 5.0 v pf 25 * used to determine the no ? load dynamic power consumption: p d = c pd v cc 2 f + i cc v cc .
mc74hc10a http://onsemi.com 4 y b c figure 1. switching waveforms input a, b, or c output y t f t r v cc gnd t phl t plh t tlh t thl 90% 50% 10% 90% 50% 10% a expanded logic diagram (1/3 of the device) *includes all probe and jig capacitance c l * test point device under test output figure 2. test circuit ordering information device package shipping ? MC74HC10ADTG tssop ? 14 (pb ? free) 96 units/tube mc74hc10adg soic ? 14 (pb ? free) 55 units/rail mc74hc10adr2g soic ? 14 (pb ? free) 2500/tape & reel mc74hc10adtr2g tssop ? 14* ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *this package is inherently pb ? free.
mc74hc10a http://onsemi.com 5 package dimensions tssop ? 14 case 948g ? 01 issue b dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ? w ? . s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l ? u ? seating plane 0.10 (0.004) ? t ? ??? ??? section n ? n detail e j j1 k k1 ? w ? 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t ? v ? 14x ref k n n 7.06 14x 0.36 14x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74hc10a http://onsemi.com 6 package dimensions soic ? 14 case 751a ? 03 issue h notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. ? a ? ? b ? g p 7 pl 14 8 7 1 m 0.25 (0.010) b m s b m 0.25 (0.010) a s t ? t ? f r x 45 seating plane d 14 pl k c j m dim min max min max inches millimeters a 8.55 8.75 0.337 0.344 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.228 0.244 r 0.25 0.50 0.010 0.019 7.04 14x 0.58 14x 1.52 1.27 dimensions: millimeters 1 pitch soldering footprint* 7x *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mc74hc10a/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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